NFC FPC Labels hpe chye ai kun ?

NFC FPC Labels hpe FPC board hte galaw da ai. flexible printed circuit board (FPC board) gaw, polyimide (sh) polyester sumla hkrung hte galaw da ai, grai kam hpa mai ai hte galai shai ai circuit board langai rai nna, npawt nhpang arung arai hku nna galaw ai. Dai hta wiring density, n-gun n law ai, n-gun n law ai hte bendability kaja ai atsam ni nga ai.
NFC gaw FPCB board hte rau, base material hpe Bluetooth speaker, NFC rings, NFC wristbands zawn re ai smart bu hpun mai ai jak amyu myu hta loi loi hte bang mai ai. NFC mobile phone hpe gaw, dai jak hpe n-gun jaw nna, pairing galaw ai lam hpe ngut kre hkra galaw na matu, sit sa mai ai.
Shi a arung arai ni a shadawn sharam ai majaw, htunghking hku nna aluminum antenna ni gaw kaji ai antenna ni hpe n mai galaw ai. Copper arung arai ni hte shingdaw yu yang, magri mang gaw grau ngang grin nna, etching hpe hkam sharang lu ai, grau ngang grin ai frequency hte kaji ai antenna ni hpe galaw lu ai. Kaji kajaw hkrak ai antenna ni hpe galaw shapraw ai lam gaw, electronic label hpaga lam hta galoi mung manghkang kaba langai mi rai nga ai, copper antenna ni hpe jai lang ai lam gaw ndai manghkang hpe awng dang hkra hparan ya lu ai.

Dai ni lang ai chip packaging process law law a akyu ara hte hkra machyi ai lam ni hpe maram yu ngut ai hpang, anhte gaw COB galaw ai lam hpe dawdan ai, hpa majaw nga yang, ngang grin ai lam hpe chyam dinglik ai lam hte hpaga lam hpe hkap la ai lam law law a majaw re. Ndai packaging ladat hpe yak hkak ai masa amyu myu hta jai lang mai nna, hpang daw de, package amyu myu hpe hkap la lu ai.
NFC hpaji masa hpe masha law law ra sharawng ai hte jai lang ai gaw, electronic tag a package size hpe kaji hkra galaw ya ai, grup yin ra kadawn ai lam ni grau sawng wa ai, structure ra ai lam ni mung grau n-gun n rawng ai.

Ndai hpaga lam a majaw, ndai arung arai hparan ladat hpe gyin shalat na matu npawt nhpang tai wa ai. Anhte gaw, magri mang etching hpaji masa hpe madung tawn nna, pi base material hpe lang nna, dai industry micro{1}}bonding ladat hpe hkap la nna, post{2}}} hpe galaw ai hte hpawn, ndai product hpe galaw shapraw ai lam hpe ngut kre hkra galaw ai. Ndai tang shawn ai lam kaw nna, chye na hkawn hkrang ai lam du hkra, arung arai ni hpe jai lang ai lam hte, hpaga lam a arawn alai ra kadawn ai lam ni hpe hpaw ya ai. Shi a tsan gang ai lam, n bung ai bungli galaw ai lam, compact size hte structure, nbung katsi ai hpe ninghkap lu ai, etc. ni a majaw, mari ai ni a myit dik lam hpe lu la sai.

FPC label hta:
1. Nbung katsi ai hpe ninghkap lu ai;
2. Bning hpe ninghkap lu ai;
3. Chemical hpe ninghkap lu ai;
4. N-gun hpe ninghkap lu ai hte
5. Kaji ai, lang na matu loi ai
high- aten ladaw masa ni hta, dai hpe arung arai ni hpe hparan na matu, hpawng chyawm ai line galaw shapraw ai jahpan ni hpe hkang ai, shang wa ai hte pru wa ai arung arai ni hpe inventory galaw na matu, shing nrai, injection molded daw ni hte rau, n-gun dat bang ai. FPC hte galaw da ai RFID electronic tag hpe injection molded daw hte hpawng de da ai, dai gaw RFID electronic tag hpe n-gun n-gun n-rawng ai (sh) n-gun n-rawng hkra pat shingdang lu ai, shi a nbung katsi ai hpe ninghkap lu ai atsam grai law ai majaw, tsi htu ai shaloi RFID chip hpe n-gun n-rawng ai. Anti{3}} recounterfeiting effect gaw grau kaja ai, dai gaw masu hkalem ai arung arai ni hpe hkan tam mai ai lam hta grai jai lang mai ai.